1 of 9 semtech protection products features ? bidirectional emi/rfi flter with integrated tvs for esd protection ? transient protection to: ? iec 61000-4-2 (esd) 15kv (air), 8kv (contact) ? iso-10605 (esd) 30kv (air), 30kv (contact) ? iec 61000-4-4 (eft) 4kv (5/50ns) ? qualifed to aec-q100, grade 1 ? resistor: 100 ? 15% ? protection and fltering for four lines ? filter performance: 30db minimum attenuation 1.8ghz to 2.5ghz ? tvs working voltage: 5v ? solid-state silicon-avalanche technology mechanical characteristics ? slp1713p8 package ? pb-free, halogen free, rohs/weee compliant ? nominal dimensions: 1.7 x 1.3 x 0.50 mm ? lead pitch: 0.4mm ? lead finish: nipdau ? marking: marking code ? packaging: tape and reel applications ? automotive color lcd ? automotive infotainment ? color lcd protection ? ccd camera lines description the ECLAMP2374KQ is a low pass flter array with integrated tvs diodes. it is designed to suppress unwanted emi/rfi signals and provide electrostatic discharge (esd) protection for automotive grade electronics. the device consists of four identical channels comprised of tvs diodes for esd protection, and a resistor-capacitor network optimized for emi/rfi fltering. a series resitor value of 100? and a capacitance value of 10pf are used to achieve 30db minimum attenuation from 1.8ghz to 2.5ghz. the tvs diodes provide efective suppression of esd voltages in excess of 15kv (air discharge) and 8kv (contact discharge) per iec61000-4-2, level 4. the ECLAMP2374KQ is packaged in an 8-pin, slp1713p8 package. the package dimensions measure 1.7 x 1.3 x 0.5mm. the leads are spaced at a pitch of 0.4mm and are fnished with a lead-free nipdau. circuit diagram (each line) package confguration nominal dimension in mm eclamp tm esd/emi protection for color lcd ECLAMP2374KQ device schematic (4x) 10pf 10pf gnd 100 ohms 1.70 1.30 1 2 0.40 bsc 0.50 ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
2 of 9 semtech absolute maximum ratings rating symbol value units esd per iec 61000-4-2 (contact) (1) esd per iec 61000-4-2 (air) (1) v esd 17 12 kv esd per iso-10605 (contact) (2) esd per iso-10605 (air) (2) v esd 17 12 kv junction temperature t j 125 o c operating temperature t j -40 to +125 o c storage temperature t stg -55 to +150 o c electrical characteristics (t=25 o c unless otherwise specifed) ECLAMP2374KQ parameter symbol conditions min. typ. max. units reverse stand-of voltage v rwm 5 v reverse breakdown voltage v br i t = 1ma, -40 o c to 125 o c 6 8 10 v reverse leakage current i r v rwm = 5v t = 25 o c 0.50 a t = 125 o c 0.006 1 a total series resistance r each line 85 100 115 ohms total capacitance c in input to gnd, each line v r = 0v, f=1mhz t = 25 o c 16 20 24 pf total capacitance c in input to gnd, each line v r = 2.5v, f=1mhz t = 25 o c 9 11 13 pf notes: (1): esd gun return path to ground reference plane (grp) (2): esd gun return path to horizontal coupling plane (hcp); test conditions: a)150pf/330pf, 330 w b) 150pf/330pf, 2k w (3): tested using a constant current source (4): transmission line pulse test (tlp) settings: tp = 100ns, tr = 0.2ns, i tlp and v tlp averaging window: t 1 = 70ns to t 2 = 90ns. (5): dynamic resistance calculated from i tlp = 4a to i tlp = 16a ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
3 of 9 semtech typical characteristics typical insertion loss s21 (each line) analog crosstalk (each line) capacitance vs. reverse voltage series resistance vs. temperature -50 -40 -30 -20 -10 0 012345 insertion loss (db) frequency (ghz) capacitance vs. temperature reverse breakdown voltage vs. temperature -70 -60 -50 -40 -30 -20 -10 0 012345 crosstalk (db) frequency (ghz) 0 2 4 6 8 10 12 14 16 18 20 012345 capacitance(pf) reversed voltage (v) f = 1 mhz 5 6 7 8 9 10 11 12 13 14 15 -75 -50 -25 0 25 50 75 100 125 150 175 capacitance (pf) temperature (c ) f = 1 mhz v r = 5v 100 101 102 103 104 105 -50 0 50 100 150 resistance ( ? ) temperature ( c) 6.0 6.5 7.0 7.5 8.0 8.5 9.0 -50 0 50 100 150 vbr (v) temperature ( c) vbr @ 1ma ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
4 of 9 semtech typical characteristics esd clamping (8kv contact per iec 61000-4-2) esd clamping (-8kv contact per iec 61000-4-2) esd clamping (+8kv contact per iso-10605 330pf, 330 w ) esd clamping (-8kv contact per iso-10605 330pf, 330 w ) 0 1 2 3 4 5 6 7 8 9 10 -10 0 10 20 30 40 50 60 70 80 clamping voltage (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground plane. -10 -8 -6 -4 -2 0 2 -10 0 10 20 30 40 50 60 70 80 clamping voltege (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 20db attenuator. esd gun return path connected to esd ground plane. 0 5 10 15 20 25 -10 10 30 50 70 clamping voltage (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 10db attenuator. esd gun return path connected to board ground -12 -10 -8 -6 -4 -2 0 2 -10 0 10 20 30 40 50 60 70 80 clamping voltage (v) time (ns) measured with 50 ohm scope input impedance, 2ghz bandwidth. corrected for 50 ohm, 10db attenuator. esd gun return path connected to board ground ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
5 of 9 semtech application information device connection pin identifcation 1 - 4 input lines 5 - 8 output lines center tab ground the ECLAMP2374KQ is comprised of four identical circuits each consisting of a low pass flter for emi/rfi suppression and dual tvs diodes for esd protection. the device is in a 8-pin slp package. electrical connection is made to the 8 pins located at the bottom of the device. a center tab serves as the ground connection. the devices has a fow through design for easy layout. pin connection are noted in figure 1. all path lengths should be kept a short as possible to minimize the efects of parasitic inductance in the board traces. recommendations for the ground connection are given below. ground connection recommendations parasitic inductance present in the board layout will afect the fltering performance of the device. as frequency increases, the efect of the inductance becomes more dominant. this efect if given by equation 1. equation 1: the impedance of an inductor at frequency xlf xlf (l,f ) = 2**f*l where: l = inductance (h) f = frequency (hz) via connections to the ground plane form rectangular wire loops or ground loop inductance as shown in figure 2. ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. bringing the ground plane closer to the signal layer (preferably to the next layer) also reduces ground loop inductance. multiple vias in the device ground pad will result in a lower inductance ground loop over two exterior vias. vias with a diameter d are separated by a distance y run between layers separated by a distance x. the inductance of the loop path is given by equation 2. thus, decreasing distance x and y will reduce the loop inductance and result in better high frequency flter characteristics. figure 1: pin identifcation and confguration (top side view) figure 2: inductance of rectangular wire loops equation 2: inductance of rectangular wire loop ? ? ? ? ? ? ? + ? ? ? = ) d 2x ln( y ) d 2y ln( x 10 10.16 y) x, lrect(d, 9- where: d = diameter of the wire (in) l = length of the wire loop (in) y = breath of the wire loop (in) in 1 in 2 in 3 in 4 out 1 out 2 out 3 out 4 1 45 8 gnd s > @ > @ > @ s > @ > @ > @ ground via 1 signal layer ground layer layer y x d ground via 2 ground via 1 signal layer ground layer layer y x d ground via 2 ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
6 of 9 semtech application information figure 3 shows the recommended device layout. the ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). the internal vias are spaced approximately evenly from the center of the pad. the designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance (i.e. the log function in equation 2 in highly insensitive to parameter d) . figure 4 shows a typical insertion loss (s21) plot for the device using semtechs flter evaluation board with 50 ohm traces and the recommended via confguration. figure 5 shows a typical insertion loss (s21) plot using a similar board without the internal ground pad vias. the result is a more inductive ground loop. note the hump at a frequency of 2.5ghz. this is the resonant frequency of the higher ground loop inductance. figure 4: filter characteristics using recommended layout with internal vias figure 3: recommended layout using ground vias figure 5: filter characteristics using layout without internal ground vias 1 2 3 4 start . 030 mhz 3 stop 000 . 000000 mhz ch1 s21 log 6 db / ref 0 db 1: -9.1473 db 297.671 mhz 2: -19.559 db 900 mhz 3: -30.645 db 1.8 ghz 4: -34.705 db 2.5 ghz 0 db -6 db -12 db -18 db -24 db -30 db -36 db -42 db -48 db 1 ghz 100 mhz 3 ghz 10 mhz 1 mhz 1 2 3 4 start . 030 mhz 3 stop 000 . 000000 mhz ch1 s21 log 6 db / ref 0 db 1: -8.9400 db 288.002 mhz 2: -20.032 db 900 mhz 3: -23.761 db 1.8 ghz 4: -16.085 db 2.5 ghz 0 db -6 db -12 db -18 db -24 db -30 db -36 db 1 ghz 100 mhz 3 ghz 10 mhz 1 mhz ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
7 of 9 semtech outline drawing - slp1713p8 land pattern - slp1713p8 inches .016 bsc b .006 bbb aaa n d1 l e d .008 .047 dim a1 a2 a min .000 .018 0.25 0.15 .010 0.20 .008 0.30 1.40 0.20 1.20 .004 .003 8 .010 .067 .051 .012 .055 0.08 0.10 8 0.25 1.70 1.30 0.40 bsc millimeters max 0.05 0.55 dimensions min 0.00 nom (.005) .020 .001 max .002 .022 nom 0.45 0.02 (0.13) 0.50 controlling dimensions are in millimeters (angles in degrees). coplanarity applies to the exposed pad as well as the terminals. notes: 2. 1. e1 .008 .012 .016 0.20 0.30 0.40 1.30 .051 e 12 n 1.775 1.65 .070 .065 1.25 1.375 .054 .049 d a b pin 1 indicator (laser mark) a2 aaa c a1 a e e/2 e bxn bbb c a b lxn e/2 d1 e1 c seating plane d/2 this land pattern is for reference purposes only. consult your manufacturing group to ensure your notes: 2. dim x y p g h millimeters inches 0.30 .008 .023 .027 .016 .012 0.20 0.58 0.40 0.69 dimensions company's manufacturing guidelines are met. 1.85 .073 z c (.050) (1.27) 1. controlling dimensions are in millimeters (angles in degrees). k .055 1.40 p z y g (c) x k h ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
8 of 9 semtech marking 2374k yyww tape and reel specifcation device orientation in tape epa t h t d iw ) x am ( , b d 1 d e f k ) x am ( p 0p 2p ) xam( t w m m 8 m m 2.4 ) 561 . ( m m 1 . 0+5 . 1 m m 0 . 0- 500 . +95 . 0 ( ) 000 . - m m 8.0 50 . 0 ) 130 . ( 01 . 057 . 1 m m ) 400 . 960 . ( 50 . 05 . 3 m m ) 200 . 831 . ( m m 4.2 ) 490 . ( 1.00.4 m m - 00 . 751 . ( )4 1.00.4 m m - 00 . 751 . ( )4 -m50 . 00 . 2 m ) 200 . 970 . ( m m 4.0 ) 610 . ( m m 0.8 m m 3 . 0+ m m 1 . 0- ) 210 . 213 . ( pin 1 location user direction of feed 0a 0b 0k m m 01 . 0 - /+ 1 5 . 1 mm 01 . 0 - /+ 1 9 . 1 mm 01 . 0 - /+ 66 . 0 ordering information part number working voltage qty per reel reel size ECLAMP2374KQtct 5v 3,000 7 eclamp and emiclamp are trademarks of semtech corporation ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 www.semtech.com
9 of 9 semtech ECLAMP2374KQ final datasheet rev 2 revision date 1/18/2016 contactfinformation semtechfcorporation 200fflynnfroad,fcamarillo,fcaf93012 phone:f(805)f498-2111,ffax:f(805)f498-3804 www.semtech.com importantfnotice informationfrelatingftofthisfproductfandfthefapplicationforfdesignfdescribedfhereinfisfbelievedftofbefreliable,fhoweverfsuchfinformationfisfprovidedfasfaf guidefonlyfandfsemtechfassumesfnofliabilityfforfanyferrorsfinfthisfdocument,forfforfthefapplicationforfdesignfdescribedfherein.fsemtechfreservesfthefrightf tofmakefchangesftofthefproductforfthisfdocumentfatfanyftimefwithoutfnotice.fbuyersfshouldfobtainftheflatestfrelevantfinformationfbeforefplacingfordersf andfshouldfverifyfthatfsuchfinformationfisfcurrentfandfcomplete.fsemtechfwarrantsfperformancefoffitsfproductsftofthefspecifcationsfapplicablefatftheftimef offsale,fandfallfsalesfarefmadefinfaccordancefwithfsemtechsfstandardftermsfandfconditionsfoffsale.f semtechfproductsfarefnotfdesigned,fintended,fauthorizedforfwarrantedftofbefsuitablefforfusefinflife-supportfapplications,fdevicesf orfsystems,forfinfnuclearfapplicationsfinfwhichftheffailurefcouldfbefreasonablyfexpectedftofresultfinfpersonalfinjury,flossfofflifef orfseverefpropertyforfenvironmentalfdamage.ffinclusionfoffsemtechfproductsfinfsuchfapplicationsfisfunderstoodftofbefundertakenf solelyfatfthefcustomersfownfrisk.fshouldfafcustomerfpurchaseforfusefsemtechfproductsfforfanyfsuchfunauthorizedfapplication,fthefcustomerfshallf indemnifyfandfholdfsemtechfandfitsfofcers,femployees,fsubsidiaries,fafliates,fandfdistributorsfharmlessfagainstfallfclaims,fcostsfdamagesfandfattorneyf feesfwhichfcouldfarise. thefsemtechfnamefandflogofarefregisteredftrademarksfoffthefsemtechfcorporation.fallfotherftrademarksfandftradefnamesfmentionedfmayfbefmarksfandf namesfoffsemtechforftheirfrespectivefcompanies.fsemtechfreservesfthefrightftofmakefchangesfto,forfdiscontinuefanyfproductsfdescribedfinfthisfdocumentf withoutffurtherfnotice.fsemtechfmakesfnofwarranty,frepresentationforfguarantee,fexpressforfimplied,fregardingfthefsuitabilityfoffitsfproductsfforfanyf particularfpurpose.fallfrightsfreserved. ?fsemtechf2015
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